Application Information
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Scholarship Overview
This scholarship is for students with a connection to a member firm of the St. Louis, Missouri, Municipal Bond Club. To qualify for this scholarship, applicants must have a 3.0 GPA and plan to enroll full-time in an undergraduate degree program at an accredited college/university. Those eligible to apply include: full-time employees of a St. Louis Municipal Bond Club member firm and their immediate family members, retired full time employees of member firms, and the immediate family members of retired employees, the immediate family members of now deceased full time employees, St. Louis Municipal Bond Club members and their immediate family members, and retired St. Louis Municipal Bond Club members and their immediate family members. Immediate family includes spouse, dependent children and dependent grandchildren. Students at any level in their program of study are encouraged to apply. Preference will be given to applicants from the St. Louis area and to Municipal Bond Department employees of member firms and their families (see website for details).
How easy is it to apply?
Not too bad
This scholarship's application process may have items such as essays that could take a couple hours.
How much competition is there?
Relatively little!
This scholarship has a relatively low number of applicants.
Details
| Deadline: |
Apr 15 The deadline for this scholarship has passed. |
|---|---|
| Award Range: | $1,000 - $2,500 |
Contact Information
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Requirements
GPA: Is this you?
- 3.0
Class Year: Is this you?
- High school senior
- College freshman
- College sophomore
- College junior
- College senior
Home State: Is this you?
- Missouri
Community Groups: Is this you?
- St. Louis Municipal Bond Club
